2021/4/9-2021/4/11
XIAN
Website URL : http://icemie.org/
Start Date / End Date: April 09-11, 2021
Location: Xi?an, China.
Submission Deadline: Visit the website for more details
1. About the conference:
2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021) will be held on April 09-11, 2021 in Xi?an, China. EMIE 2021 provides an enabling platform for Electronic Materials and Information Engineering experts to exchange new ideas and present research results.This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. We sincerely invite you to participate in EMIE 2021 and look forward to seeing you in Xi?an!
2. Publication
All accepted conference papers will be published by Journal of Physics: Conference Series (ISSN: 1742-6588), and then submit to EI Compendex, Scopus for retrieval.
3. Important Dates
Paper Submission：Visit the website for more details
Notification of Acceptance：About 1-2 weeks after the submission
Registration Deadline: April 9,2020
Conference Dates: April 09-11, 2020
4. Submission Guides
A. Full Paper (for Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.
B. Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
C. English Template(Download)
*All submissions must not be less than 4 pages in length.
(authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)
D. Submission Methods
Please send the full paper & abstract to AIS SUBMISSION SYSTEM.
5. Call For Papers
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(a) electronic materials |
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1. semiconductor materials 2. Conductive metals and their alloys 3. Electromagnetic shielding materials 4. Dielectric materials 5. Piezoelectric and ferroelectric materials 6. Magnetic materials 7. optoelectronic materials 8. Battery 9. Microelectronic materials 10. power electronics
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11. Advanced power semiconductors 12. Distributed generation, fuel cells and renewable energy systems 13. Electromagnetic compatibility 14. Wearable electronic materials 15. electronic packaging 16. Two-dimensional material flexible optoelectronic devices 17. integrated circuits 18. sensors 19 electronic information computer materials |
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(b) Information engineering: |
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20. Information and communication engineering 21. Artificial intelligence 22. Bioinformatics 23. Software engineering 24. VLSI design and manufacturing 25. Photonic technology 26. Parallel and distributed computing 27. Data mining 28. cryptography 29. algorithm and data structure 30. Figure and combination |
31. E-commerce and E-learning 32. Geographic Information System (GIS) 33. Networking 34. Signal processing 35. Embedded system 36. Communication and wireless systems 37. Multimedia systems and applications 38. Emerging technologies |
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(c) Other related topics |
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Items |
Registration fee (By US Dollar) |
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Regular Registration (4-6 pages) |
450 USD / 3200 RMB per paper |
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Additional Paper (4-6 pages) |
430 USD / 2900 RMB per paper |
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Extra Pages (Begin at Page 7) |
50 USD / 300 RMB per extra page |
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Attendees without Papers |
180 USD / 1200 RMB per person |
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Attendees without Papers (Groups） |
150 USD / 1000 RMB per person (≥3 persons) |
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Purchase Extra Journal |
75 USD / 500 RMB per book |
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Schedule |
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April 09 |
13:00-17:00 |
Registration (Hotel) |
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April 10 |
09:00-12:00 |
Keynote Speech |
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12:00-14:00 |
Lunch Time |
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14:00-17:30 |
Oral Session |
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18:00-19:30 |
Banquet |
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April 11 |
09:00-12:00 |
Academic Investigation |
Conference Secretary: Arista Li
E-mail: emie2021@yeah.net
Tel/WeChat: +86-13922151347
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