International Workshop on Reliability Engineering and Risk Management (IWRERM’08)

Call for papers

August 21-22, 2008, Tongji University, Shanghai, China

Objective

Reliability engineering and risk management have been attracting increasing attention and attached growing importance in civil, mechanical, aerospace and aeronautics, offshore and marine engineering, as well as in many other disciplines of engineering. In this background, the aim of the First International Workshop on Reliability Engineering and Risk Management (IWRERM’08) is to bring the researchers, experts and engineers all over the world together to present and discuss innovative methodologies and the practical applications of these technologies in the field of reliability engineering and risk management. Emerging concepts as well as state of the art and novel applications of reliability principles and risk based decision making in all types of structures, infrastructures and mechanical components will be included. In this context, papers on theories, methods, algorithms, and applications are all welcome.

Topics

The following are areas of special interest, but not limited to:

·         Bridges and Buildings

·         Damage Analysis and Assessment

·         Durability

·         Life-cycle Analysis

·         Fatigue Reliability

·         Lifeline engineering and network

·         Natural and Man-made Hazards

·         Random Vibration and Stochastic Mechanics

·         Reliability Theory

·         System Reliability

·         Reliability-based Design and Regulations

·         Reliability-based Optimization and Control

·         Performance-based Design Methods

·         Uncertainty Quantification and Risk Assessment Models

·         Insurance and Management of Risk

·         Risk-Based Decision Making

·         Risk Management Methods

·         Time-dependent Reliability

Important dates

Submission and Publication

Abstracts of about 300 words on any of the above topics are invited by May 1, 2008. All abstracts and full papers must be submitted electronically in MS-WORD format to IWRERM08@mail.tongji.edu.cn. The e-mail message should include the authors' full names, affiliations and the full title of the paper. Each presenting participant can submit only one manuscript. Detailed instructions will be available at the conference website www.iwrerm08.cn. Each paper will be reviewed by at least two reviewers. The paper must be well written with acceptable English exposition, contains an informative introduction section with clear motivations. Accepted papers will be published in a special volume of the Workshop Proceedings by Tongji University Press with international standard book number (ISBN).

International Advisory Committee

A.H.S. Ang, University of California, Irvine, CA, USA (Chair)

D.M. Frangopol, Lehigh University, Bethlehem, PA, USA (Co-Chair)

O. Ditlevsen, Technical University of Denmark, Lyngby, Denmark,

R.E. Melchers, University of Newcastle, Newcastle, Australia

J. Kanda, University of Tokyo, Tokyo, Japan

T. Ono, Nagoya Institute of Technology, Nagoya, Japan

W.H. Tang, Hong Kong University of Science and Technology, Hong Kong, China

G.F. Zhao, Dalian University of Technology, Dalian, China

Xila Liu, Jiao-Tung University, Shanghai, China

Hyo-Nam Cho, Hanyang University, Ansan, Korea

Hitoshi Furuta, Kansai University, Osaka, Japan

Sang-Hyo Kim, Yonsei University, Seoul, Korea

Bruce Ellingwood, Georgia Inst. of Technology, Atlanta, Georgia, USA

Armen Der Kiureghian, University of California, Berkeley, CA, USA

 

International Scientific Committee

J. Li, Tongji University, Shanghai, China (chair)

A.H.S. Ang, University of California, Irvine, CA, USA

H.N. Cho, Hanyang University, Ansan, Korea

O. Ditlevsen, Technical University of Denmark, Lyngby, Denmark,

B.R. Ellingwood, Georgia Institute of Technology, GA, USA

M. Faber, ETH, Zurich, Switzerland

D.M. Frangopol, Lehigh University, Bethlehem, PA, USA

H. Furuta, Kansai University, Osaka, Japan

H.P. Hong, University of Western Ontario, Ontario, Canada

J. Kanda, University of Tokyo, Tokyo, Japan

K.K. Phoon, National University of Singapore, Singapore

M. Lemaire, IFMA, Clermont-Ferrand, France

S. Mahadevan, Vanderbilt University, Nashville, TN, USA

R.E. Melchers, University of Newcastle, Newcastle, Australia

Y. Mori, Nagoya University, Nagoya, Japan

T. Ono, Nagoya Institute of Technology, Nagoya, Japan

R. Rackwitz, Technical University of Munich, Munich, Germany

G. I. Schueller, Leopold-Franzens University, Austria, EU

T. Takada, University of Tokyo, Tokyo, Japan

W.H. Tang, Hong Kong University of Science and Technology, Hong Kong, China

Y.K. Wen, University of Illinois, Urbana, IL, USA

C.B. Yun, KAIST, Daejon, Korea

Y. Zhao, Nagoya Institute of Technology, Nagoya, Japan

W.Q. Zhu, Zhejiang University, Hangzhou, China

J.L. Beck, California Institute of Technology, Pasadena, CA, USA

L.A. Bergman, University of Illinois, Urbana, IL, USA

C. Bucher, Vienna University of Technology, Vienna, Austria,

M.K. Chryssanthopoulos, University of Surrey, Guilford, UK

M. Ciampoli, University of Rome "La Sapienza", Rome, Italy

J.P. Conte, University of California, San Diego, CA, USA

A.C. Estes, California Polytechnic State University, San Luis Obispo, CA, USA

L. Esteva, National University of Mexico, Mexico City, Mexico

M. Ghosn, City University of New York, New York, NY, USA

M. Gioffrè, University of Perugia, Perugia, Italy

L. Graham-Brady, Johns Hopkins University, Baltimore, MD, USA

A. Haldar, University of Arizona, Tucson, AZ, USA

S. Hanayasu, Yokohama National University, Yokohama, Japan

M. Holicky, Czech Technical University, Prague, Czech Republic

J.B. Chen, Tongji University, Shanghai, China

Z.H. Lu, Nagoya Institute of Technology, Nagoya, Japan

H.A. Jensen, Santa Maria University, Valparaiso, Chile

A. Kiremidjian, Stanford University, Palo Alto, CA, USA

C.G. Koh, National University of Singapore, Singapore

T. Moan, Norwegian University of Science and Technology, Trondheim, Norway

D. Novak, Brno University of Technology, Brno, Czech Replublic

A.S. Nowak, University of Nebraska, Lincoln, NE, USA

M. Pandey, University of Waterloo, Waterloo, Ontario, Canada

M. Papadrakakis, National Technical University of Athens, Athens, Greece

U. Peil, Technical University of Braunschweig, Braunschweig, Germany

J.D. Riera, UFRGS, Porto Alegre, Brazil

H. Sandi, Institute of Geodynamics of the Romanian Academy, Bucharest, Romania

W. Shiraki, Kagawa University, Takamatsu, Japan

K. Sobczyk, Polish Academy of Sciences, Warsaw, Poland

C. Soize, University of Marne-Vallée, La Vallée, France

T.T. Soong, State University of New York, Buffalo, NY, USA

M.G. Stewart, University of Newcastle, Newcastle, Australia

D. Val, Technion, Haifa, Israel

J.M. van Noortwijk, HKV Consultants and TU Delft, Delft, The Netherlands

W.L.Jin, Zhejiang University, China

Q.X.Wu, Hohai University, China

Z.Z.Lv, Northwestern Polytechnical University, China

B.Huang, Wuhan University of Technology, China

 

Symposium Organization Committee

Chairman: Prof. Jie Li (Tongji University, China)

Vice-chairman: Prof. Yangang Zhao (Nagoya Institute of Technology, Japan)

 

Sponsors

AIJ,

Post-symposium tour

Shanghai is a fascinating metropolis for tourists from both home and abroad. At the sight of the bustling Huangpu River and the magnificent SuZhou Creek, You will soon have a series of fantastic reveries. Today, Shanghai undergoes a great change every three years in addition to achieving a change every year. With a tremendous success achieved in reform and development, this world-known metropolis has now become not only China's center of economy, finance, trade and navigation, but also an international metropolis on the western bank of the Pacific Ocean, noted for its having an intriguing, unique blend of Chinese and Western cultures. In short, Shanghai has turned itself into an open, fashionable and dynamic metropolis. Just like Yulan (magnolia, the symbol flower of the city) in bloom, Shanghai is full of life and vitality, and, at the same time, just as a pacemaker, it strides forward day and night in high spirits.

Further information can be found at http://www.shanghai.gov.cn/. 

 

Fees

The registration fee for presenters is US$400. The registration fee will cover attendance at all sessions of the symposium, symposium teas and lunches, one set of the published symposium proceedings, the welcome reception and the symposium dinner as well as tour around Shanghai. The registration fee for students is US$200. For accompanying persons, the registration fee will be US$100 without presenting proceedings. The fees for presenters from Mainland China will be further noticed.