The 2021 7th International Conference on Materials, Mechanical Engineering and Automation Technology

2021/6/18-2021/6/20

DALIZHOU

Website URL :http://mmeat.cn/

Start Date / End Date:  June 18-20, 2021

Location: Dali, China.

Submission Deadline: Visit the website for more details



1. About the conference:

The 2021 7th International Conference on Materials, Mechanical Engineering and Automation Technology (MMEAT 2021) will be held on June 18-20, 2021 in Dali, China. MMEAT 2021 is to bring together innovative academics and industrial experts in the field of materials, mechanical engineering and automation technology to a common forum. The primary goal of the conference is to promote research and developmental activities in information technology and computer science and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in materials, mechanical engineering and automation technology and related areas.



2. Publication

All submissions will be peer reviewed, and the accepted papers will be published in the Conference proceedings and will be submitted to EISCOPUS for indexing.   



3. Submission Guides

A. Full Paper (for Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.

B. Abstract (Presentation only)

Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

C. English Template(Download)   

*All submissions must not be less than 4 pages in length.

(authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)

D. Submission Methods

1.Please send the full paper & abstract to AIS SUBMISSION SYSTEM.



4. Call for papers

Topics include but are not limited to the following areas:

New Materials and Advanced Materials

Materials of lighting source 

Semi-conductor materials

Insulating materials 

Electronic materials

Non-ferrous Metal material

Iron and Steel

Composites / Thin Films

Micro / Nano Materials

Ceramic

Optical/Electronic/Magnetic Materials

Earthquake Materials and Design

Biomaterials

New Functional Materials

Environmental Friendly Materials

Smart/Intelligent Materials/Intelligent Systems

Polymeric Materials

Building Materials

New materials, New Technology and New Products

Corrosion of Materials and Surface treatment technology

Mechanical Behavior & Fracture 

New Energy Materials 

Tooling Testing and Evaluation of Materials

Research and Development of Composite Materials

Research and Development of New materials

Mechanical Engineering

Mechanical Dynamics and Vibration

Mechanical Strength

Mechanical Friction, Wear and Lubrication  

Mechanical Design

Rolling 

Casting Technology and Equipment

Welding Technology and Equipment 

Plastic Processing Technology and Equipment

Heat treatment technology and Equipment 

Cutting Technology and Equipment

Special Processing Technology and Equipment  

The Machine Assembly Process

Non-metallic Processing

Fluid Power Transmission and Control 

Instrumentation

Power Mechanical Engineering

Vehicle Engineering

CNC Technology and Numerical Control Machines

Agricultural Machinery Manufacturing

Mining Machinery Engineering

Chemical Machinery and Equipment 

Textile Machinery and Equipment

Food Machinery

Metallurgical Machinery and Automation

Construction Machinery and Equipment

Aircraft Structure and Design

Aircraft Manufacturing Technology

Spacecraft Structure and Design


Control, Automation and Information Technology

Control System Modeling and Simulation technology

Intelligent Optimization Agorithms and Applications

Fluid Power Transmission and Control

Production Process Simulation

Network Control

Electric Automation

Vehicle Control Systems

Computer Integrated Manufacturing

Microelectronics Technology

Embedded Systems

The Photoelectron IT and System

Intelligent Traffic Control

Computer System Structure

Software Development and Application

Computer Application Technology

 



5、Registration

   Items 

   Registration fee (By US Dollar) 

  Regular Registration (4 pages)

500 USD / 3200 RMB per paper

  Extra Pages (Begin at Page 5)

 50 USD / 300 RMB per extra page

  Attendees without Papers

 180 USD / 1200 RMB per person

  Attendees without Papers (Groups)

 150 USD / 1000 RMB per person (≥3 persons)

Purchase Extra Journal

75 USD / 500 RMB per book



6. Schedule

Schedule

June.18

13:00-17:00

  Registration (Hotel)

June.19

09:00-12:00

  Keynote Speech

12:00-14:00

  Lunch Time

14:00-17:30

  Oral Session

18:00-19:30

  Banquet

June.20

09:00-12:00

  Academic Investigation 



7.Contact Us

Conference Secretary: Arista Li

Tel: +86-13922151347

WeChat: 86-13922151347

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